This report presents the worldwide HTCC Ceramic Substrates market size (value, production and consumption), splits the breakdown (data status 2013-2018 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.
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Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
High temperature Ceramic Substrates means that the sintering temperature is around 1,600 C (2,910 F).
In the short term, Japan, United States and Europe will have an unshakable status in HTCC ceramic substrates; China will play an more important role in future, driven by the strong demand from consumer electronics, aerospace & military, automobile electronics and LED market.
The HTCC Ceramic Substrates market was valued at 110 Million US$ in 2017 and is projected to reach 130 Million US$ by 2025, at a CAGR of 2.3% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for HTCC Ceramic Substrates.
The following manufacturers are covered in this report:
NGK Spark Plug
SCHOTT Electronic Packaging
Semiconductor Enclosures Inc(SEI)
HTCC Ceramic Substrates Breakdown Data by Type
Al2O3 HTCC Substrate
AIN HTCC Substrate
HTCC Ceramic Substrates Breakdown Data by Application
Aerospace & Military
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HTCC Ceramic Substrates Production by Region
HTCC Ceramic Substrates Consumption by Region
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